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NEW USB TRANSCEIVER

The USB1T11ABQ is a USB transceiver in micro leadframe packaging (MLP). MLP occupies up to 84% less board space than comparable TSSOP and SOIC packages, and brings USB 1.1 performance to mobile phones, digital cameras, PDAs, printers, set-top boxes, and other space-constrained applications.

The USB1T11ABQ transceiver interfaces 5- or 3.3-V standard or programmable logic to the USB physical layer; it supports both 12-Mbps full-speed and 1.5-Mbps low-speed data transmission rates. I/O signal compatibility with the USB Implementers Forum’s VHDL "Serial Interface Engine" specification helps engineers to easily design, modify, and update USB 1.1 applications using off-the-shelf logic.

Utilizing the JEDEC MO-220 (3 mm2) form factor, the MLP package eliminates coplanarity problems caused by flexing leads, as sometimes occurs with TSSOP and SOIC package designs. Other MLP-derived design benefits include a lower component height of 1 mm for space-restricted portable designs, lower thermal resistance because of the component’s center DAP that connects directly to the die and PC board, and the device’s 0.5-mm pin-to-pin pitch that supports current manufacturability standards. The USB1T11ABQ costs $0.65 in 1000-piece quantities.

Fairchild Semiconductor
(888) 522-5372
www.fairchildsemi.com

 

   
Published: September 2003